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    十層三階HDI板
    
            
    Release time：2019-08-28 Editor author：Jin Zhi Zhu Read：32172
    
            
    
    層數： 10L

    

    
    板厚： 1.2mm  

    

    
    特殊要求：樹脂塞孔

    

    
    表面處理：沉金

    

    
    材料：FR-4 TG170

    

    
    外層線寬/線距: 2.95/2.95mil

    

    
    內層線寬/線距: 2.36/2.36mil

    

    
    最小孔徑： 盲孔0.1mm，埋孔0.2mm，通孔0.2mm

    

    
    銅厚：外層1oz，內層0.5oz & 1oz
    

    

    
    十層三階HDI板-1.jpg

    
		
    
		

        
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